For our latest round of testing, we asked seven leading
blade server vendors to send a chassis and four x86-based server
blades with Ethernet connectivity to our new Green Bay, Wisconsin,
US, Real-World Labs. Hewlett-Packard, Rackable Systems and Sun
Microsystems agreed. Fujitsu and Dell declined; IBM said it had no
available hardware; and Egenera begged off, saying it
“doesn’t connect to iSCSI storage.”
HP sent its ProLiant c-Class BladeSystem, which
for our testing comprised a 10U ProLiant c7000 chassis, two 3.2 GHz
Xeon ProLiant BL460c blades, two dual-3.2 GHz Xeon ProLiant BL480c
blades, and four GbE (Gigabit Ethernet) 2c Ethernet blade switches
for the c-Class BladeSystem.
Rackable Systems provided five of its Scale Out Blade
Servers—four dual 2.2 GHz Low-Power Opteron 275 HE Scale Out
Blade Servers and a dual 2.6 GHz Opteron 285-based Scale Out Blade
Server.
Sun delivered its recently-released Sun Blade 8000 Modular System,
which included a 19U Sun Blade 8000 Chassis, four full-height
quad-2.6 GHz Opteron 885 Sun Blade X8400 server modules, two Sun
Blade 8000 GbE 20-port Network Express modules, four PCIe Dual-GbE
ExpressModules, two PCIe Dual Infiniband ExpressModules, and two
PCIe QLogic dual 4-Gb Fibre Channel ExpressModules.
When we first reviewed blade servers, in June 2003 (see
‘Pitching Blades,’ at nwc.com/1411/1411f2.html), we
were looking to answer the question: is managing blades easier than
dealing with a stack of 1U or 2U servers? The answer, then as now,
is an unqualified yes. But other aspects of blade servers,
including design, energy efficiency, throughput and fabrics
supported have improved significantly.
(For an overview of what to look for when shopping for a blade, see
‘Data Center Diet Plan.’)
FORM UP
We found significant architectural variations among the
three blade systems tested. Rackable’s Scale Out system is
targeted at high-density environments looking to provide hundreds,
even thousands of individual system nodes. Its hot-plug design lets
IT load one rack with as many as 88 server modules in a
side-by-side and back-to-back configuration.
With an optional 19-inch mount kit, conventional racks can hold
five vertical chassis in a 7U space. Rackable’s affordable
Scale Out blades come in both single- and dual-processor versions
and can be populated with Intel Xeon or AMD Opteron processors.
On-blade storage is provided by one or a pair of internal, 3.5-inch
SATA or SCSI drives, and server I/O options are limited to dual GbE
ports.
But what makes Rackable unique in this market is its multiple power
alternatives—letting Scale Out blades be used in AC or DC
environments—and the fact that its blades are based on an
open-architecture server module designed to accommodate a wide
range of standard motherboards and hard disks. If you need the
flexibility to tailor blade configurations based on specific
hardware requirements, Rackable has you covered.
Meanwhile, the Sun Blade 8000 Modular System is built for speed,
with the performance to handle demanding applications such as
Oracle or SAP. Its 19U chassis can hold 10 four-processor blade
modules, each equivalent to a conventional 4U racked server.
Storage is provided by one or a pair of 2.5-inch SAS drives per
blade.
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Sun has chosen to align with AMD, so it offers only Opteron
processors. This may not sit well with some IT managers, but we can
only hope that the days of namebrand prejudice will come to an end
eventually.
What sets Sun’s servers apart are its exclusive use of
four-processor blades and its gutsy decision to move network
components off the blades and on to the chassis backplane. This
breaks the traditional blade-design mold, where each blade must be
configured with the desired combination of NICs or HBAs at the time
of purchase.
The Sun Blade 8000 server modules have no NICs or HBAs, and all
communication from the blade is kept strictly PCIe. Each blade has
four x8 PCIe and two x4 PCIe links that run through the passive
midplane of the chassis. These provide substantial bandwidth to two
individual x8 PCIe Express modules per blade, as well as four
Network Express modules that provide shared connectivity across all
ten blades.
This unique methodology allows hot-pluggable I/O customization of
individual blades using optional Ethernet, FC or InfiniBand PCIe
Express modules, while simultaneously supporting as many as eight
additional GbE connections per blade.
Finally, the new HP ProLiant c-Class BladeSystem offers the most
balanced approach of the three systems we reviewed. Targeted at
enterprise data centers and server consolidation, the 10U c7000
enclosure supports as many as eight full-height dual-processor
blades, 16 half-height dual-processor blades, or any combination
thereof. HP offers blades with either Intel Xeon or AMD Opteron
processors, and its halfheight blades can support two hot-swappable
2.5-inch SAS drives, while the full-height blades can handle as
many as four drives each.
Although not quite as beefy as the Sun Blade when it comes to
chassis-level I/O bandwidth, the c-Class surpasses its predecessors
by offering the flexibility of multiple, integrated GbE NICs on
each blade, as well as the option to add two additional NIC or HBA
modules—known as mezzanine cards—on the halfheight
blades and three more on the full height.
The internal GbE NICs and mezzanine cards are mapped to eight bays
on the chassis backplane that can be populated with a wide choice
of switches and pass-through modules, using up to four different
fabrics.
MANAGE ME
We weighted system management at 20 percent of our grade.
Rackable’s optional Roamer management system provides
Ethernet or serial connectivity and an LCD status panel. The
text-based management interface gave us remote access to basic
power cycling, BIOS configuration, system reset and temperature
monitoring, but little else in terms of system status information,
event logging or automated problem reporting.
The Sun Blade 8000 System offers on each Server Module an
Integrated Lights Out Manager (ILOM) on each Server Module that
combines with the Chassis Monitoring Module to provide secure,
browser-based and onsite access to a broad spectrum of status
monitoring and system configuration tools. The hardcore Sun
worshipper will be pleased to find a DMTF-compliant CLI as
well.
Sun also offers its optional Sun N1 System Manager software, which
supports an even broader set of features, including bare-metal
discovery, OS provisioning, and the ability to manage hundreds of
systems across multiple chassis and racks from a single console. We
believe N1 System Manager would be a worthwhile addition for large
environments, but the software is available only for Solaris.
HP’s Integrated Lights-Out 2 (ILO 2) management interface,
now in its fourth generation, teams with HP’s Onboard
Administrator module to provide single-session management of all
blades and I/O devices in the chassis. We found many similarities
in the ILO management capabilities of the HP and Sun systems, but
HP goes the extra mile, providing additional features with its new
HP Onboard Administrator.
This handy app integrates with existing ILO 2 features on all
components, plus provides both local and remote control over the
enhanced management tools added to the BladeSystem c-series; these
include such unique features as real-time control over power and
cooling, visual indicators of fault conditions and configuration
errors, and simplified diagnostics and graphical instructions for
troubleshooting.
We were also impressed with HP’s elegant and flexible local
interface. A multifunction LCD display, located at the base of each
chassis, gave us access to all Web interface management features,
including role-based security, context-sensitive help, and
graphical displays of problem components. A chat mode allows
technicians at a remote location to communicate. Handy stuff.
Building on these integrated tools are a wealth of high-level
software products from HP that offer expanded control of the server
environment; these include the Insight Control Data Center Edition
management suite for rapid provisioning, software installation and
license management, and the ILO Select Pack for additional security
and reporting features. And at the top of the food chain,
there’s the HP Open View line of enterprise-level management
tools.
FEEL THE HEAT
Rackable’s Scale Out blades support three power
options. The least efficient is an all-AC configuration, using
blades with conventional AC power supplies. The second setup
combines DC-powered blades with AC/DC rectifiers for power
conversion at rack level. These rectifiers can be configured for
redundancy and mounted either on-rack or outside the data center
for better heat management.
In addition, Rackable’s Scale Out blades are mounted in a
back-to-back configuration at rack-level, so exhaust heat is ducted
to the top of the rack rather than to the back of the system and
into the aisle or rack behind it.
Perhaps the most energy-efficient option would be for data centers
wired for redundant -48 DC. These shops can use DC-powered blades
in combination with Rackable’s DC power-distribution system,
which allows the rack to connect directly to a central DC power
supply.
Rackable’s DC-powered blades incorporate a DC power supply
with no moving parts that generates much less heat—while
being several times more reliable—than conventional power
supplies. One liability to the Scale Out blade design, however, is
its incorporation of two high-speed fans in each blade module. This
setup works well to manage heat generated by the blades themselves,
but it offers no redundancy or hot-swap capabilities; not to
mention a full rack of 88 Scale Out blades would have 176 fans
running at all times.
Most of the power efficiency provided by the chassis-based blade
systems from HP and Sun stems from their ability to consolidate
power and cooling at rack level. While supplying redundant power to
conventional servers requires that dual, active power supplies be
mounted in each server, the blade chassis designs from HP and Sun
use a maximum of six power supplies to handle the entire rack. This
provides both AC redundancy and N+N power-supply redundancy.
Cooling fans are handled in the same manner, with both chassis
offering redundant, high-efficiency, multi-speed, hot-swappable fan
modules that automatically respond to variations in the cooling
needs of all blades in the chassis.
A feature unique to HP is Dynamic Power Saver, which lets an
administrator choose between AC redundancy, power-supply redundancy
and a power-saving mode that allows some power supplies to shut
down during off-peak periods.
One of the main problems with AC power supplies is that
they’re inefficient when running under reduced demand, so the
Dynamic Power Saver automatically puts unnecessary power supplies
on standby, letting the system run fewer power supplies at higher
and more efficient utilization levels.
Administrators can actually set a hard limit on the amount of AC
power a chassis or rack can consume. This affects only new loads
and not cooling, so there’s no risk to systems already
online. This is not a hard limit on the power, but rather a
threshold setting.
The number of available power supplies and their redundancy level
also determine the power available to the chassis; the system will
automatically limit the number of server blades that can come
online based on those guidelines and the power draw of the system.
It’s a nifty high-level feature.
I/O BANDWIDTH
We evaluated all three vendors’ designs to see
whether they’d be able to keep up with high-speed fabrics
such as 4 Gb FC, 4x InfiniBand and 10 GbE, while still providing
GbE links for management and network use.
The dual GbE ports in Rackable’s Scale Out system provide
2-Gbps throughput; this lower bandwidth will limit use in many
high-performance applications—however, Rackable’s
target audience seems to run more toward those needing high server
density rather than fat pipes.
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In contrast, the Sun Blade 8000 wowed us with its capacity. Its
midplane can handle up to 9.6 Tbps in combined throughput, and Sun
specs the systems at 160 Gbps of usable bandwidth per blade.
HP’s BladeSystem c-series is no slouch either, with 5 Tbps
midplane bandwidth. We liked that HP provides additional high-speed
cross connects between adjacent blade sockets—a boon for
multi-blade clustered and storage-specific applications.
System bandwidth aside, the major difference between the Sun and HP
designs lies in the location of their I/O devices. Sun has chosen
to extend multiple PCIe interfaces from the blade, through a
passive midplane, and to the chassis backplane, where it locates
all I/O devices for FC, InfiniBand and Ethernet connectivity. On
the other hand, HP’s approach uses a passive serial midplane
to connect specific fabrics that originate on the blade, with the
backplane reserved for switch or pass-through modules.
ANY PORT IN A STORM?
We also evaluated port diversity and flexibility. Ideally,
integrated switch modules enable blade systems to support multiple
fabrics across multiple servers. If this is important to you,
HP’s BladeSystem c-series offers the greatest port diversity
in terms of available backplane switches and pass-through
modules.
On the HP c-series, GbE switch modules are available from both HP
and Cisco, and FC adapters from either Emulex or QLogic. You also
can use pass-through adapters that can provide direct connections
between blade-level adapters and third-party switches. Aside from
the dual, integrated GbE ports on the half-height and the four
ports on the full-height blades, HP offers multifunction GbE
mezzanine cards that support TCP/IP off-loading as well as iSCSI
acceleration and RDMA (remote direct memory access)
capabilities.
When it comes to features, port diversity and overall system
flexibility, we have to give this round to HP. But it was a close
call thanks to the remarkable bandwidth offered by the Sun
Blade’s PCIe midplane architecture.
Sun offers connectivity for most fabrics through the use of
individual Ethernet, InfiniBand and FC PCIe Express modules
connected by two individual x8 backplane slots per blade. But at
this point, the only option available for Sun’s four
aggregated Network Express slots on the chassis backplane is a
20-port GbE pass-through module. Even though this offers the
potential for eight individual GbE ports per blade—with room
to spare for two x8 PCIe Express Modules—the absence of
shared switching modules limits the Sun Blade 8000’s overall
flexibility. This makes Sun pretty much all dressed up with nowhere
to go at this point, but we’ll be keeping an eye on
developments in this area.
On the Scale Out blades from Rackable Systems, dual onboard GbE
ports are wired along with serial/Ethernet management
communications through a blind-mating connector at the back of the
blade; they terminate within the rack as standard RJ-45 network
cables. Because there is no dedicated chassis, there are no
integrated switch modules; instead, space is left available in a
full rack to allow for installation of third-party switching
equipment. An open PCI slot located on the front panel of the blade
is available for conventional FC or Infini-Band adapters, but this
would necessitate routing individual cables to the front of each
blade and finding room in the rack to accommodate additional
switching.
PRICE DILEMMA
The disparate architectures of these blade systems made
comparing price difficult. We created a formula that pitted two
dual-processor, Opteron 285-based server blades from HP and
Rackable Systems against a single four-processor Opteron 885-based
blade from Sun. We priced each system on a blade level with similar
memory, SATA storage and dual-port GbE connectivity, without
consideration for the differences in chassis/rack capabilities.
The Scale Outs from Rackable Systems came in at $9,780 for two
dual-processor blades, making them the least-expensive option on a
processor-by-processor basis. The HP BladeSystem landed in the
middle of the pack, at $11,768 for a pair of ProLiant BL465c
half-height blades. An equivalent Sun Blade would run $24,885 when
you include the cost of the two PCIe Express GbE modules required
to match the port counts of the other two systems. We expected
this—the fact that its design requires 800-series rather than
200-series Opterons would make Sun about $6,000 more expensive than
rivals from the get-go. We think the premium is worthwhile, though,
for companies that can make use of the Sun Blade’s power.
Our as-tested pricing for each system: HP, $36,546, Sun, $149,680
(both including chassis and modules). Rackable, $9,780 (server
blades only, no chassis or power supplies).
From a warranty aspect, both HP and Sun offer a three-year warranty
on the chassis and blades with next-business-day response times for
onsite service, while the Rackable Systems Scale Out servers have a
one-year warranty combined with an RMA repair program.
All three vendors have both Web-based and 24/7/365 telephone
accessibility and offer a number of optional, multi-year support
plans that can provide up to 24/7/365 onsite service. Overall, HP
offers the most complete matrix of service options for both
hardware and software support, but Sun has upped the ante by
launching a new pricing scheme that reduces maintenance costs by
covering all devices within the entire chassis.
AND THE WINNER IS...
Our Editor’s Choice is HP’s ProLiant c-Class
BladeSystem. This well-rounded offering provides a winning
combination of system performance, module flexibility and price,
backed by a strong service and support structure. We found the HP
management system the most user-friendly and energy-conscious, and
it’s obvious that HP has put a great deal of thought into
solving many of the problems associated with earlier generations of
blade servers. It earned consistently high scores across all
grading areas.
The beefy Sun Blade 8000 Modular System earned a perfect score for
I/O bandwidth and could be a solid alternative to conventional
servers for core-level applications such as large Oracle or SAP
environments, as well as high-performance I/O and computationally
intensive apps. Its combination of four-way blades and massive
bandwidth at both blade and midplane level sets a new standard for
x86-based blade performance and throughput. Still, as much as we
liked its performance capabilities, the Sun Blade 8000 is somewhat
pricey and currently offers only one I/O module option for its four
Network Express slots.
In contrast, the cost-effective Scale Out blades from Rackable
Systems would be well suited to edge applications that value
extremely high server density over I/O performance.
HEWLETT-PACKARD: C-CLASS BLADESYSTEM
HP designed the new c-Class BladeSystem, released in June
2006, to replace the p-Class, with an eye toward providing enough
system performance and flexibility to carry the platform well into
the next decade. One thing that came through loud and clear in our
testing is HP’s focus on simplifying management. This,
combined with outstanding energy efficiency and a substantial list
of connectivity options, earned HP top marks for enterprise-class
blade servers.
In an interesting departure from its earlier systems, the new
c-Class offers a choice of full- or half-height server blade
modules. This flexible design lets the eight-slot chassis support
as many as eight full-height or 16 half-height blades, or any
combination thereof. At this point, both full and half blades
support a maximum of two processor sockets per blade, but the
full-blade design appears to have plenty of room for four-socket
full-height blades at some point in the future.
The system we tested came equipped with two full-height blades
sporting a pair of 3.2 GHz dual-Core Xeon processors, and two
half-height blades, each with a single 3.2 GHz dual-Core Xeon.
There is a wide variety of half-height blade options available for
the c-Class BladeSystem; the Intel-based BL460c modules sport two
CPU sockets and a choice of nine different dual-core Xeon
processors ranging from 1.6 GHz to 3.2 GHz, and also support as
many as eight sockets of PC2-5300 DDR2 FB-DIMM memory.
The AMD-based BL465c blades offer a choice of seven different
Opteron 2000-series processors and provide eight sockets for
PC2-5300 DDR2-registered DIMM memory. Each half blade has room for
dual 2.5-inch hot-swappable SAS or SATA drives and comes with an
integrated HP SmartArray E220i RAID controller that supports 0, 1
and 0+1 arrays.
Common to both half-blade designs are a pair of integrated,
multifunction GbE NICs that support TCP/IP off-load under Windows,
as well as accelerated iSCSI and RDMA capabilities. For other
connectivity options, there are two onboard mezzanine sockets that
can be used for additional standard or multifunction GbE modules
and 4x DDR InfiniBand, as well as 4 GB FC modules from Emulex or
QLogic. All blades for the c-Class provide connectivity for
HP’s Integrated Lights Out 2 (ILO 2) system management
interface without sacrificing a dedicated GbE port, and a
high-density connector on the front of each blade uses a custom
fan-out cable for direct KVM/USB connections.
The full-height blade we tested for the c-Class was the BL480c;
like the BL460c, the 480 is available with 11 dual-core Xeon
processor options. Although sharing the same processing capacity as
its half-height brethren, the 480’s full-height design leaves
room for 12 total slots of PC2-5300 DDR2 FB DIMMs, two additional
embedded GbE ports, three total mezzanine cards, and as many as
four hot-swap SAS or SATA drives. Also included is an integrated HP
Smart Array P400i SAS controller with 256 MB of cache and support
for hardware RAID 0, 1 and 5. HP has also recently released the new
BL685c blade, which is based on four Opteron 8000-series processors
and offers as many as 16 DIMM sockets supporting DDR2 memory.
The c7000 chassis offers a substantial number of features that
improve the system and energy management capabilities of the
c-Class compared with HP’s previous p-Class design.
At the heart of the 10U chassis is an Onboard Administrator
Management Module that provides secure single-sign-on access to
device configuration, power usage, system monitoring and
temperature control over all components in single or multiple
enclosures. It also serves as a single point of access to the ILO 2
systems on each blade, and supports virtual KVM services over
Ethernet for ILO 2-enabled systems across multiple enclosures
assigned to a common management domain.
HP put a lot of effort into simplifying its management interface,
and it shows. Along with detailed online management capabilities, a
front-mounted LCD Insight Display at the base of each chassis
provides for text-based trouble-shooting, graphical error
indication and a live-chat mode that allows a technician in a data
center to communicate with an administrator working from a remote
management terminal.
The c7000 chassis is available in single- and three-phase versions
for US or international power sources. Slots for as many as six
front-accessible power supplies provide multiple levels of power
redundancy.
HP offers one of the most detailed power management systems in
blades today, and unique to HP’s c7000 is new Dynamic Power
Saver technology that allows the system to reduce the number of
active power supplies during off-peak usage. Also unique is the
ability of an administrator to set a hard power budget for single
or multiple chassis, enabling the system to dynamically choose the
amount of resources that will be allowed to come online.
System cooling is another integral part of HP’s energy
strategy, and its new Thermal Logic technology combines detailed
inflow and outflow temperature analysis with a highly manageable,
load-balancing cooling system.
Based on the PARSEC (Parallel Redundant Scalable Airflow)
architecture, the c7000 can use as many as 10 of the new high-flow,
low-noise HP Active Cooling fans to provide independent zone-based
cooling at blade level, with full redundancy across the chassis.
This new fan module design is the quietest we’ve ever heard,
which is especially, well, cool given its capacity—HP told us
that a single Active Cooling module has the power to cool as many
as five DL360 G4 1U servers.
The c7000 is rated for 5 Tbps in raw SerDes
(serialization-deserialization) bandwidth. Because HP continues to
keep storage and I/O modules on the blade, the chassis must be able
to ensure that fabrics are connected properly through the midplane.
To do this, the Administrator Management Module offers port-mapping
capabilities that let us ensure that adapters mounted in mezzanine
ports on the blades were properly connected to the interconnect
bays in the backplane. A dedicated link between adjacent blade
slots is available to support server clustering and connect to
storage-specific blades in the future.
The last step in the I/O chain is connectivity at the backplane,
and the c-Class offers the largest number of backplane options of
the systems we tested. At the rear of the c7000 chassis are two
bays for dual, redundant Administrator Management Modules and eight
additional interconnect bays, each with 16 connections to the blade
modules. Two of the interconnect bays are dedicated to redundant
GbE switches; the remaining six can be populated with connectivity
modules for Ethernet, FC, InfiniBand or SAS fabrics.
This design can offer fully redundant backplane support for as many
as four fabrics simultaneously on a system filled with full-height
blades. There are also pass-through adapters that can provide
direct connections between blade-level adapters and third-party
Ethernet or FC switches for companies that prefer to handle
switching outside the chassis.
SUN MICROSYSTEMS: SUN BLADE 8000 MODULAR SYSTEM
When Sun discontinued its Sparc/Athlon/Xeon-based Sun Fire
B1600 Blade Platform in mid-2005, the company vowed to be back in a
year with a whole new blade system. It wasn’t kidding. The
new Sun Blade 8000 Modular System, which bears little resemblance
to its 3U predecessor, incorporates one of the most interesting
technology decisions we’ve seen to date: by taking I/O
modules off the blades and extending the PCI Express bus through
the midplane, Sun can locate fabric connectivity modules at the
backplane and provide for hot-swapping of PCIe Express modules
without the need to take a blade offline.
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From the start, it was obvious to us that the major focus of the
Sun Blade 8000 is performance. This is perhaps best illustrated by
the fact that only four-socketed blades are being built for the
system. For the new Sun Blade X8400 Server Modules, Sun is
partnering with AMD. At present, its blades are based on quad-940
sockets, which leave three available Opteron processor options: the
870, 875 and 885. Of course, this is only a temporary limitation
because blades based on the new 1207-pin Rev.F socket and
8000-series processors will support both current dual-core and
future quad-coreOpterons without a major blade redesign.
At 19.5 inches by 18.5 inches, the X8400 server modules are the
largest that we tested. But Sun takes full advantage of that real
estate and loads them up with four dual-core processors and sixteen
sockets of system memory. Each blade has two hot-swappable 2.5-inch
SAS or SATA drives and front-mounted sockets for conventional
KVM/USB hookups. There’s also an on-board ILOM service
processor that offers remote KVM and storage capabilities and
supports Sun’s management interface as well as third-party
IMPI 2.0-compliant management solutions.
Conspicuously absent on these modules are the blade-mounted
Ethernet and storage adapters that we’ve come to know and
love. All the I/O capabilities in the Sun Blade design are routed
directly through the passive midplane using four x8 and two x4 PCI
Express links per blade. This unique methodology supports 160 Gbps
of total usable bandwidth from each individual blade and eliminates
the need to pull a blade to replace a failed I/O module.
Like the X8400 blades, the Sun Blade 8000 chassis was the largest
we tested. At a height of 19U, it weighed in at over 500 pounds and
supports 10 server modules when fully configured. But, considering
that a fully-loaded Sun Blade 8000 Modular System offers the
processing equivalent of 10 conventionally racked, four-socket 4U
servers, the 8000 is an impressive, brushed aluminum tower of
power. Like the HP c-Class, the Sun Blade 8000 chassis supports
dual redundant CMMs (Chassis Management Modules), which provide a
unified management interface for all components and servers.
The CMM offered us detailed monitoring capabilities for module
status and temperature parameters, and is designed to integrate
with management tools for Sun’s high-end X64-based systems.
The 8000 chassis has six front-mounted power supplies that offer
N+N redundancy for input and output power; it uses 3-6 single-phase
20A 220V circuits, depending on the level of redundancy desired.
System cooling is provided with multi-speed, hot-swappable fans.
Three fans are dedicated to cooling the top PCI Express modules,
six are for the power supplies, and nine are mounted at the back of
the chassis to cool the server modules.
Perhaps the most impressive aspect of the Sun Blade 8000 Modular
System stems from Sun’s decision to use a passive midplane
concept that passes the PCI Express system bus through the system,
rather than using blade-based GbE, FC or InfiniBand I/O fabrics.
This design offers 40 serial links per server—or a total of
400 serial links—and provides a massive 9.7 Tbps of overall
SerDes chassis bandwidth that can be designated to any combination
of fabrics and I/O modules that can be mounted at the
backplane.
Though this may seem like overkill at present, the adoption of
high-speed interconnects like 10 GbE, X4 DDR InfiniBand and 8- or
10-Gbps FC will all occur during the anticipated lifecycle of these
blade systems, a factor that should make total system bandwidth a
point of consideration to ensure long-term investment
protection.
The bandwidth and flexibility offered by the PCI Express-based
design has provided Sun with some interesting and unique I/O
options.
Of the four 8x PCIe channels available per server module, two slots
per blade are dedicated to individual PCIe Express modules based on
the PCI SIG form factor and mounted at the top rear of the chassis.
To fill the 20 available slots per chassis, Sun offers three
possible PCIe Express modules: an Intel-based dual-port GbE NIC, a
QLogic-based dual-port 4-Gbps FC HBA, and a Mellanox-based
dual-port 4x InfiniBand host channel adapter. These hot-pluggable
modules can be mixed and matched on a server-by-server basis,
allowing for a great deal of granularity.
The remaining two 8x and two 4xPCIe channels are connected to four
PCI Express Network Express Module (NEM) slots located directly
below the individual PCIe modules. These four slots are designed to
aggregate the links from all 10 server modules, and could be used
for four different, or two redundant, aggregated I/O fabrics.
At this point, the only NEM module available is a 20-port GbE
device offering dual GbE NICs per server module; Sun says it will
address this limitation in the near future. In spite of the current
lack of NEM options, we respect the leap of faith Sun took to adopt
this I/O strategy. Given its adoption of an industry-standard
PCIe-compliant architecture, it’s hard to imagine that I/O
device vendors will have difficulty fitting Sun’s design
specifications for the smaller, individual PCIe Express
modules.
The bigger challenge may be to find switch vendors with designs
that will convert multi-server PCIe input to an aggregated,
switched fabric output. A technology that seems ideally suited here
is the anticipated development of I/O devices with hardware-enabled
virtualization capabilities. An I/OV-enabled device would be
capable of presenting multiple virtual interfaces to the combined
PCIe connections provided by the NEM slots; for example, four
I/OV-capable 10 GbE NICs could potentially be shared among all 10
server modules.
RACKABLE SYSTEMS: SCALE OUT SERVER SERIES
Rackable Systems introduced its Scale Out servers in 2004
as an alternative to conventional blade servers. Rather than
adopting the typical chassis/module concept, Rackable’s
design is based on providing the highest possible server density
combined with a unique, fullrack-oriented design. By mounting Scale
Out Blades in a side-by-side and back-to-back configuration,
Rackable squeezes 88 servers in a single 88 in-by-28 in-by-44 in
cabinet, offering as many as 176 CPUs—or 352 cores. Now
that’s density.
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Rackable has also been a long-term advocate of the adoption of DC
power to improve overall energy efficiency and reduce the cooling
burden in the modern data center. Rackable prides itself on
delivering what it calls ‘open blades’—which in
this case means blade designs based on industry-standard components
such as standard-formfactor motherboards, 3.5-inch disk drives, and
a wide variety of processor selections from either Intel or
AMD.
Rackable could base a Scale Out Blade on almost any server-class
ATX motherboard that can fit in its case, offering a great deal of
flexibility for individual customers with specific needs.
For this review we requested an AMD system based on a pair of
dual-core Opteron processors, but Rackable Systems would have been
able to provide practically any combination of processor we could
have requested. When we opened up the Scale Out blade we found a
conventional ATX dual-socket 940 motherboard with 8 DIMM sockets
mounted with the I/O risers facing the front of the blade chassis.
This allowed access to the
KVM and USB ports through a panel on the front. The dual onboard
GbE NIC ports were jumpered using Category 6 cabling to a
blind-mating connector at the back of the chassis.
By mounting the motherboard backward—relatively
speaking—Rackable leaves room above the PCI slots to
internally mount dual, 160-GB, 3.5-inch SATA drives; we could have
incorporated SAS storage or as many as four 2.5-inch drives in
either flavor. The power supply is mounted right behind the drives
at the back of the chassis, and dual high-speed fans provide
cooling for the entire module. Like conventional blade designs, the
Scale Out modules are designed to be hot-pluggable without the need
for tools.
Chassis? Who needs a chassis? Perhaps the biggest departure from
the conventional blade model is Rackable’s chassis-less
approach. The closest thing we could find to a chassis is the
custom rack-mounting system that the Scale Out blades require.
Cooling air is drawn from both the front and back of the rack, and
exhaust air is directed straight up through the top of the rack.
Each blade has dual independent fans, which equates to 176 total
fans in a full rack.
Each server module uses a relatively low-density blind-mating
connector that provides power to the blade as well as I/O
connectivity for the Ethernet and optional serial connections. In
the middle of the rack these connectors tie into an integrated
cabling system that terminates in RJ-45 connectors near the switch
mounting bays. For companies requiring support for additional
connectivity, there’s access to an open PCI slot in the front
of the blade, but this would necessitate routing cables from the
face of any affected servers to the required switch.
Absent the chassis, there’s no need for chassis-level
management. But this also means that Rackable Systems offers no
integrated, unified server management interface. The optional
Roamer management interface available on the Scale Out blades
provides individual control of basic power-cycling and BIOS
settings while monitoring ambient case temperatures, but absent a
centralized management interface we saw limited out-of-the-box
options for large-scale system management without resorting to
third-party software. In this regard, the Scale Out Blades are
identical to conventionally racked servers.
Aside from extremely high processor density, what makes the Scale
Outs stand out are the three powering options offered by Rackable
Systems. For those choosing an AC-only power option at blade-level,
the Scale Out Blades offer pretty much the same energy efficiency
as conventional servers, and depend on a 1:1 ratio between AC power
supply and blade.
The real power efficiency lies in systems based on DC-powered
blades that use system-wide DC or DC power that’s converted
at rack level.
First, the internal DC power supplies for the Scale Out servers are
more efficient, generate less heat, and are far less prone to
failure than conventional AC power supplies. And by supporting DC
at blade-level, you can use multiple DC rectifiers at rack level to
provide the same N+N power redundancy found in chassis-based
designs. For the ultimate in power efficiency, Rackable Systems
advocates the adoption of data-center-level DC power, which could
be converted outside the data center to decrease thermal load
inside.
The biggest downsides of Rackable Systems’ design are limited
I/O bandwidth and options for the Scale Out blades we tested. These
systems can obviously provide substantial processing capabilities,
but would be bottlenecked for a number of applications by the
limitations imposed by their dual-GbE NICs.
Even though there is room for one additional, front-facing PCI
card, this clearly wouldn’t be an optimal solution in many
data centers. We hope this is an issue Rackable addresses in the
next generations of Scale Out systems. Given the company’s
‘open blade’ strategy, it’s likely that rapid
advancements in server-class ATX motherboard design will offer new
alternatives in the future, but the relatively low density of its
existing blind-mating connector will still lead to bandwidth
limitations.
In all fairness, there are a number of applications that function
perfectly well in a GbE-only environment. We’ve also found
that many shops using Ethernet-based iSCSI for storage rarely
stress their dual GbE connections, and most 1U and 2U racked
servers come standard with only two GbE ports. With its affordable
Scale Out blades, Rackable Systems is clearly targeting
server-intensive environments such as telcos and service providers,
where massive scalability equals efficiency, and affordability can
be a key factor.